您现在的位置: 河北大学建筑工程学院 >> 师资队伍 >> 工程力学

牛晓燕

        

作者:佚名    转贴自:本站原创    点击数:7995    更新时间:2012-11-19    文章录入:admin

个人简历

姓    名:牛晓燕         性    别:女 

出生日期:1979.2.25      政治面貌:党员

籍    贯:河北省沙河市   学    位:博士

专    业:固体力学       联系电话:15932289368

职    称:副教授、硕士研究生指导教师        

工作单位:河北大学建筑工程学院

电子邮件:niu-xiaoyan2002@163.com,niuxiaoyan@hbu.edu.cn

教育经历

Ø        2003.9-2009.6  在太原理工大学应用力学与生物医学研究所,固体力学专业硕博连读;

Ø        1998.9-2002.6  在河北科技大学机械电子工程学院,过程装备与控制工程专业学士学位。

 

研究方向及课题

研究方向:

Ø        弹塑性结构的动力响应;

Ø        材料在高应变率下的动态力学行为;

Ø        材料在微/纳米尺度下的力学性能。

Ø        新型结构与材料中的力学问题

参与的基金项目:

Ø        2012.01-2014-12    河北省自然科学基金项目:微系统封装中低银无铅钎料的微-宏观动态力学行为研究(A2012201003)。项目负责人; Ø        2010.07-2013.07    河北大学引进人才基金项目:微电子封装中无铅焊点的实验研究与可靠性分析(2010-187)。项目负责人; Ø        2011.05 -2012.05     河北大学大学生科技创新项目:电子封装用低银含量无铅钎料动态力学性能研究,指导教师 Ø        2012.01-2015.12    国家自然科学基金:强动载荷下碳纤维增强复合夹芯结构的动力行为及其吸能机理研究。第四负责人; Ø        2009.01-2011.12    山西省回国留学人员科研资助项目:电子封装用高聚物材料湿热影响改性后力学性能的研究。第四负责人; Ø        2007.01-2009.12    国家自然科学基金:无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究,第三负责人; Ø        2006.01-2008.12    高等学校博士学科点专项科研基金:分子筛单晶体弹塑性本构关系研究,第三负责人; Ø        2007.01-2009.01    山西省自然科学基金:无铅焊料电子封装芯片动力学问题的研究,第二负责人; Ø        2006.05-2007.05    山西省研究生创新项目科研基金:无铅电子封装芯片在复杂环境及冲击过程中的动力失效研究,项目负责人。

 

 

发表论文情况

[1] Xiaoyan Niu, Xuefeng Shu, Characterization of the Creep Constitutive Behavior of SnAgCu Solder in Flip Chip Joints from the Indentation Creep Testing, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp 156-159. (EI)

[2] Xiaoyan Niu, Tong Chen; Zhigang Li; Xuefeng Shu, Modeling solder joint reliability of VFBGA packages under board level drop test based on dynamic constitutive relation with thermal effect. 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, pp 365-369, 2009/8/10. (EI)

[3] Tong Chen, Xiaoyan Niu; Xuefeng Shu; Jianwen Zhang. Dynamic Constitutive Relation of EMC over a Broad Range of Temperatures and Strain Rates 2009 International Conference on Electronic Packaging Technology & High Density Packaging , ICEPT-HDP 2009, pp 733-736, 2009/8/10. (EI)

[4] Xiaoyan Niu, Guozheng Yuan, Zhigang Li, Xuefeng Shu. Study on Dynamic Failure model of lead-free solders using shpb techniques. International Journal of Modern Physics B, APR 30,2008, 22(9-11): 1117-1122. (SCI);

[5] J. Lin, X.Y. Niu, X.F. Shu, Reverse Analysis for Determining the Mechanical Properties of Zeolite Ferrierite Crystal, Journal of Nanomaterials, vol. 2008, Article ID 395738, 7 pages. (SCI),

[6] X.Y. Niu, T. Chen, Z.G. Li and X.F. Shu, Dynamic constitutive relationship of lead-free solder alloys based on Johnson-Cook model with thermal effect, DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading, 855-859.(ISTP)

[7] T. Chen, X.Y. Niu, Z.G. Li and X.F. Shu Flow stress of lead-free solder alloys over a broad range of temperatures and strain rates DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading, 1437-1442 (ISTP)

[8] Xiaoyan, Niu; Yong, Ma; Zhigang, Li; Xuefeng, Shu; Guitong,Yang. Investigation of the stress-strain curves of lead-free solder alloy. EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p 4525022. (EI);

[9] Zhigang, Li; Xiaoyan, Niu; Yong, Ma; Xuefeng, Shu; Guitong, Yang. Cavitation instability in the plastic IC packaging material due to moisture-induced vapor pressure and thermal stress. EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p 4525023. (EI);

[10] Niu Xiaoyan, Li Zhigang, Yuan Guozheng, Shu Xuefeng. Experime- ntal Studies on the Dynamic Compressive Properties of Lead-Free Solder. Journal of Shanghai Jiaotong University (Science), V13, n SUPPL, April, 2008, p.74-77 (EI);

[11] Li Zhigang, Niu xiaoyan, Shu Xuefeng. Unstable Void Growth in Ther-mohyperelastic Plastic IC Packaging Material due to Thermal Load and Vapor Pressure. Journal of Shanghai Jiaotong University (Science), V13, n SUPPL, April, 2008, p.71-73. (EI);

[12] Niu Xiaoyan, Li Zhigang, Yuan Guozheng, Shu Xuefeng. Hygrother-mal mechanical analysis of a Flip Chip Package by finite element method. The 5th International Conference on Nonlinear Mechanics (ICNM-V) (ISTP). 2007, 829~832.

[13] Niu Xiaoyan, Lin Jiang, Zhang Xiaomei, Shu Xuefeng. Numerical

simulation for determining mechanical properties of a single Crystal

from nanoindentation. The 5th International Conference on Nonlinear

Mechanics (ICNM-V) (ISTP). 2007, 823~828.

[14] Li Zhigang, Niu xiaoyan, Meng Liqing, Shu Xuefeng. The study of moisture induced vapor pressure and weakened interfacial strength in CSP packages. The 5th International Conference on Nonlinear Mechanics (ICNM-V) (ISTP). 2007, 212~215.

[15]  马永,牛晓燕,李志刚,树学锋。沸石分子筛纳米压痕实验影响因素的数值研究。兵器材料科学与工程,Vol.31, No.5, Sept, 2008, pp:5-10.

[16]  牛晓燕,林江,树学峰。沸石分子筛单晶体弹塑性双线性本构关系的实验研究与有限元确定。《固体力学学报》,2006,27(4),394~398。

[17]  牛晓燕,林江,树学峰。镁碱沸石FER单晶弹塑性双线性本构关系

的实验研究与有限元确定。第十届全国现代数学和力学学术会议,

2005,682~685。 

[18]  牛晓燕,林江,树学峰。单晶体SOD力学性能的实验及数值模拟。

《太原理工大学学报》,2005,36(2),119~122。

[19]  林江,牛晓燕,树学峰。方沸石大单晶及多晶粉饼力学性能的实验

研究。《应用力学学报》(EI),2005,22(3), 400~403。